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Main Business

About cleaning

Cleaning of KoMiCo is a process to remove contaminants such as particles and ionic impurities of equipment parts generated during customers' process. We also provide various solutions to maintain and control the surface of damaged parts to meet each process requirement by minimizing damage of basic material, removing process contaminants, increasing product life, improving uniformity and controling micro contamination.

  1. PhaseⅠInitial stage of cleaning

    Introduced semiconductor parts cleaning
    technology for the first time in Korea

    Precise cleaning per material and process

    Improvement of physical
    cleaning technology →
    CO2 Cleaning, Bead, Arc Coating

    0.3 ㎛ Size Particle Control

  2. PhaseⅡOptimization
    of products
    surface treatment

    Improved various physical cleaning technologies →
    Improved the surface suitable for various needs of customers

    Cleaning processes on products with various functions & composite materials

    Precision of cleaning

    0.1μm Size Particle control

  3. PhaseⅢIntroduction of
    Nano cleaning technology

    Optimization of surface treatment →
    Improvement of process yield

    Reduction of Particle source by increasing surface area per product

    Precision of cleaning process →
    Introduction of quality management system

    0.04㎛ Size Particle control

  4. Phase ⅣEvolution of Nano cleaning technology

    SMART Factory – Automation

    Application of flexible recipe per product

    Control of micro process → Reduction of process defect of customers

    Development of eco-friendly cleaning technology

    Increase of product life and decrease of delivery time

    0.01um Size Particle Control

Major cleaning technology

KoMiCo provides proper cleaning technology for various processes and parts of our customers. In addition to eliminating process contaminants, we are constantly researching and developing to provide optimal solutions to control the particles and maximize products' life through the best surface conditions for any parts.

  CuStrip™ CleanPeel™ SurFinish™ SurfRestore™
Purpose of use Removal process of contaminants by minimizing the damage of the basic material of parts at the Cu process Improvement of parts life time by minimizing parts damage Reduction of Al CVD Showerhead basic materials and hole damage Restoration of plasma etching surface damage of quartz material products
Effect Reduction on the etch rate of basic materials Extension of parts life time Extension of parts life time Particle Source Reduction
Maintenance of gas flow uniformity
Particle improvement
Extension of parts life time
Products Al Collimator,
AlCoverRing etc.
Products such as PVD Process Shield CVD Process Showerhead Quartz Window,
Quartz pedestal, etc.
Effect

Image with cleaning

  • Collimator

  • Inner Shield

  • Depo Ring

  • Shower Head

  • Shutter Disk